Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
When it comes to process-control systems, reliability is crucial and failure can be costly or dangerous. A combination of good design practices, component selection, and testing can enhance ...
At the end of February, PICMG (PCI Industrial Computer Manufacturers Group)—the consortium for open hardware specifications—introduced InterEdge, a modular architecture for process control systems ...
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