Intel’s embedded multi-die interconnect bridge (EMIB) technology—aiming to address the growing complexity in heterogeneously integrated multi-chip and multi-chip (let) architectures—made waves at this ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

Recently, reports indicated that Intel outsourced its high-end EMIB chip packaging to Amkor Technology for the first time, using Amkor’s advanced facility in South Korea. This move highlights Amkor’s ...

Intel Foundry's design ecosystem has hit a new milestone as key partners Ansys, Cadence, Siemens, and Synopsys release reference flows for Intel's Embedded Multi-die Interconnect Bridge (EMIB) ...

SANTA ROSA, Calif.--(BUSINESS WIRE)--Keysight Technologies, Inc. (NYSE: KEYS) announced today a collaboration with Intel Foundry to support Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology ...

Embedded Multi-die Interconnect Bridge-T (EMIB-T) was a prominent highlight of the Intel Foundry Direct Connect event. Intel is promoting this advanced packaging technology as a key building block for ...

Intel is a renowned player in the computer CPU business. The company recently launched its 10th Gen Intel processors, which are now based on 10nm fabrication. Besides designing computer CPUs, the ...

Intel’s EMIB was the foundation of the Kaby Lake-G partnership with AMD. Intel’s Foveros stacked-die technology produced the upcoming Lakefield chip. Now Intel is combining EMIB and Foveros into what ...

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Intel was the dominant semiconductor chip maker for decades. They were a generation or two ahead of all competitors. However, six years ago Intel started badly missing deadlines for new chips. Intel ...