CYBERJAYA, Nov 6 — Malaysia today launched its second integrated circuit (IC) design park in Cyberjaya, marking another ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Efficient Operator Learning for Fast and Trustworthy Thermal Simulation and Optimization in 3D-IC Design” was published by ...

2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a ...

The power-performance-area (PPA) metric and time-to-market of modern system-on-chips (SoCs) are dominated by two major issues: on-chip interconnects and layout parasitics. Especially, as the industry ...

Cadence is ushering in “the future for custom analog design” with Virtuoso Studio. The San Jose, California-based company said the new platform takes care of many of the challenges its customers face ...

Chief minister Chow Kon Yeow says this reflects the state’s commitment to building homegrown chip design capabilities.

Microchip Technology’s MCP3909 energy-measurement IC and the MCP3909 3-Phase Energy Meter Reference Design enable designers to quickly design and develop energy meter designs. The IC combines low ...