TweakTown

Samsung bets on next-gen glass interposers replacing silicon, robots as the next big thing

TL;DR: Samsung Electronics is prioritizing advanced semiconductor packaging and robotics as key growth engines, focusing on next-gen glass interposers to enhance AI chip performance by 2028. The ...
abc27

Mosaic Microsystems Announces Strategic Hire: Andrew Garland Joins as Sr. Process Engineer to Drive Next-Gen Glass Interposer Packaging Solutions

ROCHESTER, N.Y., April 11, 2024 /PRNewswire/ -- Mosaic Microsystems, a leader in the field of microelectronic glass packaging solutions using glass substrate, announced today the addition of Andrew ...
Digi Times

Samsung reportedly advances development of glass interposers to boost semiconductor performance

Samsung Electronics has reportedly begun developing a next-generation packaging material, the "glass interposer," a move aimed at replacing the costly silicon interposers currently used in ...
Yahoo Finance

Global Glass Substrates for Semiconductors Market Report 2026-2036: Technical and Economic Hurdles Amid Strategic Opportunities Through Quantum-Neuromorphic-Edge Convergence

Dublin, Oct. 07, 2025 (GLOBE NEWSWIRE) -- The "The Global Market for Glass Substrates for Semiconductors 2026-2036" report has been added to ResearchAndMarkets.com's offering. The Global Glass ...