AI data centers are breaking traditional cooling models. Vendors are responding by accelerating the shift to liquid cooling ...

Compact electronics present a unique challenge when it comes to cooling. While thermal management is becoming a growing concern amid increased chip functionality, smaller devices mean there’s less ...

Framework for modelling transverse thermoelectric materials• Direct measurement of temperature dependent band gaps• ...

UNIVERSITY PARK, Pa. — Next-generation electronics will feature smaller and more powerful components that require new solutions for cooling. A new thermoelectric cooler developed by Penn State ...

Power density plays a critical role in making power electronic systems smaller, more efficient, and more cost-effective. As power density increases, so does the heat generated inside a device.

Thermal management deals with problems arising from heat dissipation, thermal stresses and warping. It is critical in the packaging of power semiconductors and other microelectronic and optoelectronic ...

Jensen Huang, President of NVIDIA holding the Grace hopper superchip CPU used for generative AI. Cooling a data center was a challenge even before the current AI-driven boom in accelerated computing ...

The high power consumption of electronic systems, driven by applications in Artificial Intelligence (AI) and High-Performance Computing (HPC), is generating a significant demand to address overheating ...

With a new year upon us, many of us are looking to 2026 with at least some optimism that it will be a better year than last for many tech sectors. The electronics industry held its own last year given ...