Typical 3D thermal simulation of electronics components assumes that all the power consumption the data sheets define is dissipated in the semiconductor. In the case of high current power modules, ...
Many aspects of semiconductor design and verification have an ever-growing “need for speed” that has outpaced the performance improvements available by running on CPUs. Electronic design automation ...
Purdue’s new engineering laboratory will have six computer workstations, each capable of true 3D workpiece simulation without needing access to a CNC system. Purdue University’s College of Engineering ...
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