What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

Nanoelectronics deal with extremely small electronic components — transistors, sensors and circuits that can fit on the tip of a needle. This technology powers our everyday lives through devices such ...

The landscape of IC design is experiencing a profound transformation. With the physical and economic limits of conventional two-dimensional scaling, the industry is rapidly embracing three-dimensional ...

The Korea Research Institute of Standards and Science (KRISS) has developed an artificial intelligence (AI)-based image ...

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...

Using state-of-the-art density functional theory (DFT) simulations, they showed that when a single layer of the semiconductor ...

A Chinese research team has built an all-perovskite tandem solar cell with a 19.6%-efficient wide bandgap top cell relying on a 2D/3D heterostructure and narrow bandgap bottom cell with a 21.3% ...

A new category of sensing technology transforms mobile robot vision from 2D to 3D, improves safety performance and provides 50-80% cost savings compared to traditional, LiDAR-based systems and sensor ...

Sonair is pushing towards a new sensor built on 3D ultrasonic technology, giving autonomous robotics the power to see and make the right decisions. Ralph W. Bernstein is the senior business developer ...