The news is coming from TheElec, with their sources saying Samsung's Advanced Package (AVP) team will be providing an interposer and I-Cube -- its 2.5D package -- to NVIDIA. Other companies will ...

We're hearing the news from TheElec's sources, who said Samsung has ordered 16 units of the equipment from the packaging firm, with the South Korean giant receiving 7 of the units already, and will ...

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

Samsung Electronics is not only investing actively in the R&D and capacity expansion of high-bandwidth memory (HBM) technology, but also looking to broaden its market reach through customized one-stop ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its ...

High-performance computing, 6G communication, autonomous vehicle chips, and consumer electronics are all key markets that benefit from advancing semiconductor packaging. IDTechEx's report, "Advanced ...

Although Samsung has been the subject of market rumors regarding Nvidia's placement of its 2.5D packaging orders, industry sources recently said there is no information regarding the timetable for ...

Marvell Technology MRVL uses advanced CMOS technologies at 5nm and 3nm nodes and is now shifting toward 2nm and below, which include innovations like gate-all-around transistors and backside power ...

J.P. Morgan started coverage on Amkor Technology (NASDAQ:AMKR) with an Overweight rating and a price target of $48. Analysts led by Peter Peng noted that the Tempe, Ariz.-based company is a key ...

Hanmi Semiconductor announced on September 10 that it will unveil two new pieces of equipment for AI semiconductors-the "2.5D Big Die TC Bonder" and the "Big Die FC Bonder"-for the first time at the ...

Semiconductor packaging and testing company Amkor Technology (NASDAQ:AMKR) reported Q1 CY2025 results , but sales fell by 3.2% year on year to $1.32 billion. The company expects next quarter’s revenue ...